Talk
Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials
When
· 7:00 PM MST
Shown in the venue’s time zone (America/Denver), not yours.
Where
Boulder, CO
Tickets
No on-sale date recorded
This event came from a public calendar feed. Calendar feeds publish when a show happens, not when its tickets go on sale — so this is genuinely unknown rather than zero, and rather than “already on sale”.
What the source said
Darren Hitchcock, senior business development manager, Panasonic will cover how how package and PCB material choices affect signal integrity, manufacturability, and performance in high-speed systems. This presentation is in association with CU Boulder’s High Speed Digital Engineering (HSD) Program. We aim to connecting students, researchers, and industry professionals through technical talks on signal integrity, packaging, PCB design, interconnects, power integrity, and modern high-performance computing.